Research Papers

Thermal Resistance of Common Rice Maintainer and Restorer Lines to  High Temperature Stress During Flowering and Early Grain Filling Stages

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  • National Key Laboratory of Rice Biology, China National Rice Research Institute, Hangzhou 310006, China; #These authors contributed  equally to this paper;

Received date: 2011-01-12

  Revised date: 2011-03-30

  Online published: 2011-09-10

Abstract

Fifteen common rice maintainer lines and 26 highyielding   restorer lines were used to evaluate their thermal resistance and fertility during flowering and early grain filling stages. The  rice plants were subjected to high temperature stress at  39-43 ℃ for 1-15 d  from main stem flowering. Based on the high temperature stress index, they were divided into thermal resistant lines, semithermal resistant lines, semithermal sensitive lines and thermal sensitive lines. Therefore, the maintainer lines K22B,  Bobai B and V20B  belonged to  thermal resistant lines, whereas Ⅱ32B,  Zhongzhe B and Zhong 9B to thermal sensitive lines. The rice restorer line  Minghui 63 had the highest  thermal  resistance,  followed by  R207, P929,  and the lowest thermalresistant  P6222,  R8006 and P51. The correlation analysis indicated that  the high temperature stress index was not  significantly  correlated with  seedsetting rate, abortive grain rate, unfilled grain rate  under natural conditions, but significantly correlated with   seedsetting rate and unfilled grain rate under high temperature stress. This indicated that high temperature stress occurred during floweringearly grain filling stage mainly decreased the  seed setting rate and significantly increased the unfilled grain rate in both rice maintainer and restorer lines.

Cite this article

FU Guanfu#, SONG Jian#, LIAO Xiyuan, ZHANG Xiufu, XIONG Jie, WANG Xi, LE Mingkai, TAO Longxing* . Thermal Resistance of Common Rice Maintainer and Restorer Lines to  High Temperature Stress During Flowering and Early Grain Filling Stages[J]. Chinese Journal OF Rice Science, 2011 , 25(5) : 495 -500 . DOI: 10.3969/j.issn.10017216.2011.05.007

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